Thermal paste consists of a polymerizable liquid matrix and large volume fractions of electrically insulating, but thermally conductive filler. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste. Thermal paste is an example of a thermal interface material.Īs opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste (also called thermal compound, thermal grease, thermal interface material ( TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. Silicone thermal compound Metal (silver) thermal compound Metal thermal paste applied to a chip Thermal paste is designed to fill surface imperfections on the surface of a chip In background: Arctic Silver thermal paste remover. From left to right: Arctic Cooling MX-2 and MX-4, Tuniq TX-3, Cool Laboratory Liquid Metal Pro, Shin-Etsu MicroSi G751, Arctic Silver 5, Powdered Diamond. Fluid used to maximize thermal contact Several containers of thermal paste of different brands.
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